The recent buzz in the semiconductor industry is all about advanced packaging, a heterogeneous platform that enables the integration and miniaturization of systems. With supply chain shortages and most of semiconductor manufacturing being done off-shore, there is a wake-up call by the US government to regain US leadership and competitiveness in this upcoming area. This is a prime opportunity for US universities to step-in and drive innovation, transition these innovations into manufacturing, while creating the next workforce. The fundamental challenge,…